Kenwood announced the introduction of three new power amplifier models that combine high performance with a new thin chassis profile and small-footprint design. To achieve the thinner chassis profile, Kenwood designed each amplifier for the highest efficiency of space. This was made possible by reducing the footprint of the power supply by 40% compared to a conventional class AB design, made possible in part by the use of lower-profile power supply capacitors reduced height by 33%. Angling the internal heat sink by 45-degrees reduces height by 25% without sacrificing any heat dissipation. Moving the wiring connector strip to the inside of the amplifier and accessing all wiring connections through a removable panel on top of the amplifier reduces size, protects all connections from damage and results in a clean, professional installation. The choice of low tolerance, high quality components results in an extremely accurate, clean sound quality that becomes audible through the use of the highest quality loudspeakers.
Excelon Amplifiers - 2013 CES |
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| Cars & Vehicles | Upload TimePublished on 5 Feb 2013 |
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